Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research)
How many high-current vias do we need? (fewer than you think)
Printed Circuit Design & Fabrication 05 Dec 2023
Doug Brooks spricht zum Thema: "Via and Trace - Current and Temperature"
Videopräsentation (2023)
Johannes Adam (ADAM Research)
Verlustleistung ist nicht alles: Einfuß des Leiterplatten-Layouts. ElektronikPraxis (29.09.2022) Link
Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research)
PCB Signal Traces Are Hotter Than We Think Signal Integrity Journal (SIJ) (July 19, 2022) Link
Douglas Brooks, Ph.D. (Ultracad Inc.)
Thermal management: A close look at vertical heat flow in PCBs Electronics Design News (EDN) (October 19, 2021) Link
Johannes Adam (ADAM Research)
Don't believe the data sheets. Design007 Magazine (September 2020) Link
Das ganze Heft mit Beiträgen von Doug Brooks (Vias) und Mike Jouppi (IPC-2221, IPC-2152) Link
Douglas Brooks, Ph.D. (Ultracad Inc.), Johannes Adam (ADAM-Research)
Current Density: Interesting, But Irrelevant Signal Integrity Journal (SIJ) (January 30, 2020) Link
David Kalas; Karel Sima; Silvan Pretl; Jan Reboun; Radek Soukup; Ales Hamacek (Department of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia, Pilsen, Czech Republic)
Temperature Distribution Optimization for Multichannel Sensor System for Thermal Testing of Protective Gloves. 42nd International Spring Seminar on Electronics Technology (ISSE) (2019)
https://ieeexplore.ieee.org/abstract/document/8810285
Shusmitha Kyatam, Pedro Camacho, Luís Rodrigues, Luís Nero Alves, Joana Catarina Mendes (Instituto de Telecomunicações, Campus Universitário de Santiago, Aveiro, Portugal)
Thermal analysis of high power LEDs using different PCB materials. European Conference on Circuit Theory and Design (ECCTD) (2017) https://ieeexplore.ieee.org/abstract/document/8093259
Johannes Adam (ADAM Research)
Feature interview Dr. Johannes Adam Sounds the Alarm for Thermal Design by Andy Shaughnessy I-CONNECT007. The PCB Design Magazine (pp 16. December 2017).
Link
Das ganze Heft: http://iconnect007.uberflip.com/i/916068-pcbd-dec2017
Weitere: pcb-magazine, pcb-design-magazine,smt-magazine ,iconnect007
Douglas Brooks, Ph.D. (Ultracad Inc.)
Feature interview Thermal Management Update with Douglas Brooks.by Andy Shaughnessy I-CONNECT007. The PCB Design Magazine (pp 22. December 2017).
Link
Nitesh Kumar Sardana (Robert Bosch Engineering & Business Solution (RBEI))
Simulation Driven Design Optimization for Reduction of Temperature on a High Current Density PCB. Electronics Cooling (July 27, 2017).
Johannes Adam (ADAM Research)
Simulated and Experimental Temperature. Essais et simulation (No 127. pp 38. Janvier-Fevrier 2017).
Les caractéristiques thermiques de composants électroniques sont publiées, cependant pour les cartes électroniques ce n’est pas souvent le cas. Le logiciel TRM permet de créer un modèle thermique à partir des données de conception et de fabrication d’une carte électronique, dans son environnement (position, température, ventilation…). ... . Link
Johannes Adam, Christian Tichet (EDA Expert srl)
Intérêt et précision de la simulation thermique sur une carte électronique. Les cahiers de l’industrie électronique et numérique (mars 2017, No. 91, pp. 40-41).
Link
Douglas Brooks, Ph.D. (Ultracad Inc.)
Exiting New Technology: Thermal Risk Maganagament. The PCB Design Magazine (Feb 2017).
Link
Douglas Brooks (UltraCAD Inc.), Ph.D., Norocel Codreanu, Ph.D. (Polytechnic Univ Bucuresti, UPB), and Dr. Johannes Adam
Thermal Effects around Right-Angle Trace Corners . Printed Circuit Design and Fabrication (2017).
Link
Hansang Lim, Do-Hwan Jung, Jun Seo Park (Department of Electronics Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea)
Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization. Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering Volume 231, Issue 2 (2019) https://doi.org/10.1177/095440701665749
Douglas Brooks, Ph.D. (Ultracad Inc.)
Your Traces have Hot Spots. The PCB Design Magazine (2016)
Link
Johannes Adam, Douglas Brooks (UltraCAD Inc.)
Empirisches und Theoretisches über Strom und Temperatur in Durchkontaktierungen von Leiterplatten. PLUS Heft 3 (2016). pp467-468
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Johannes Adam, Mike Jouppi (Thermal Management LLC)
Numerische Leiterplattensimulation (Thermovias) . PLUS Heft 4 (2016). pp678-679
Link
Douglas Brooks, Ph.D. (Ultracad Inc.)
Empirical Results of Fusing Tests. Printed Circuit Design and Fabrication (2015)
Link
Douglas Brooks, Ph.D. (UltraCAD Inc.) and Dr. Johannes Adam (ADAM Research)
The Dynamics of PCB Trace Heating and Cooling, and a Call to Action. PCD&F July (2016)
Link
Douglas Brooks, Ph.D. (UltraCAD Inc.) and Dr. Johannes Adam (ADAM Research)
Trace Current/Temperature Relationships. PCD&F June (2015) Vol. 32 No.6, pp. 22-27
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Mike Jouppi (Thermal Managament LLC)
Technology Specific, Current Carrying Capacity Design Charts. An Extension of IPC‐2152. Advancements in Thermal Management 2015 Link
Dr. Johannes Adam (ADAM Research)
Thermal Management of Boards and Current-Carrying Capacity. Bodo's Power System, Issue October (2011), pp. 40
Link